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  • Manifold Absolute Pressure Modules Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
  • Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
Manifold Absolute Pressure Modules
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Description

The hybrid packaging pressure sensor is a pressure chip that packages a silicon pressure sensor and signal processing circuit into a whole chip form. It has the characteristics of small shape, high reliability and high precision. The output of the analog signal after linear verification and temperature compensation of the chip is proportional to the supply voltage and is a function of the input pressure. The working pressure range of the chip is absolute voltage 10~115 kPa, the supply voltage is 5±0.5V, and the typical current is 3.0 mA.

 

Features

  • Maximum error of 1.3% in the range of 0~85°C
  • Temperature compensation range -40~125°C
  • Small size
  • High reliability, low drift
  • Single air inlet seal structure (optional)

Application

  • Automotive pressure monitoring
  • Pressure monitoring for motorcycles
  • Air pressure gauge
  • Hand-held pressure gauge
  • Various industrial automatic control

 

Technical Index

 

Table 1. Operating characteristics (VS=5 Vdc, TA=25°C, P1>P2 unless otherwise noted)

 

characteristic

Symbol

Min.

Typ.

Max.

Unit

Pressure Range

Pop

10

---

115

kPa

Operating voltage

VS

4.5

5.0

5.5

Vdc

Operating current

IO

---

2.5

3

mAdc

Minimum pressure offset (0 to 85℃) @ VS=5V

VOff

0.345

0.4

0.455

Vdc

Full-scale output(0 to 85℃) @ VS=5V

VFSO

4.595

4.65

4.705

Vdc

Full-scale span (0 to 85℃) @ VS=5V (4)

VFSS

4.148

4.250

4.360

Vdc

Accuracy (0 to 85℃)

---

---

---

±

1.3

% VFSS

Sensitivity

V/P

---

40.5

---

mV/kPa

Response time

tR

---

---

0.25

mS

Pre-processing time

---

---

10

---

mS

Offset stability

---

---

±0.5

---

% VFSS

Power-on time

tpon

---

---

10

mS

Output cap

Vo-max

 

96%Vs

 

Vdc

Lower output limit

Vo-min

 

6%Vs

`

Vdc

 

 

Table2. Maximum rating

 

Name of Parameters

Symbol

Max.

Unit

Maximum pressure

PMAX

600

kPa

Maximum voltage

Vmax

-16.5 to +-16.5

Vdc

Maximum current

Imax

10

mAdc

ESD Protection (JEDEC EIA/JESD22-A114)

 

±6

kV

Storage temperature

TSTG

-50 to 135

Operating temperature

TA

-40 to 125

Maximum Output Current

IO+

0.5

mAdc

Maximum input current

IO-

-0.5

mAdc

 

 

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